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| Series HP1 Technical METAL CASE, CASE-MOUNTED SEMICONDUCTORS HP1 Series for Single TO-3 or Stud Mount Devices DESCRIPTION OF CURVES A. N.C. Horiz. Device Only Mounted to G-10. A. N.C. Horiz. & Vert. With Dissipator. B. 200 RPM w/Diss. C. 500 RPM w/Diss. E. 1000 RPM w/Diss. * * Thermal Resistance Case to Sink is 0.1-0.3 C/W w/Joint Compound. Derate 1.0 C/watt for unplated part in natural convection only. Ordering Information Unplated IERC PART NO. Comm'l. Black Anodize HP1-000-CB HP1-TO3-CB HP1-TO3-33CB HP1-TO3-44CB HP1-436-CB HP1-T06-CB HP1-TO15-CB HP1-420-CB Mil. Black Anodize HP1-000-B HP1-TO3-B HP1-TO3-33B HP1-TO3-44B HP1-436-B HP1-T06-B HP1-TO15-B HP1-420-B Semiconductor Accommodated Hole patt. Ref. No. (see pg. 1-28) -16 17 31 18 19 23 27 Max. Weight (Grams) HP1-000-U HP1-TO3-U HP1-TO3-33U HP1-TO3-44U HP1-436-U HP1-TO6-U HP1-TO15-U HP1-420-U Undrilled TO-3 TO-3 IC TO-3 panel mount TO-3 (4-pin) TO-6, TO-36 TO-15, DO-5 Universal 35.0 35.0 35.0 35.0 35.0 35.0 35.0 35.0 HP1 Series for Single TO-66 Outline DESCRIPTION OF CURVES B. N.C. Horiz. Device Only Mounted to G-10. D. N.C. Horiz. & Vert. With Dissipator. E. 200 RPM w/Diss. F. 500 RPM w/Diss. E. 1000 RPM w/Diss. * * Thermal Resistance Case to Sink is 0.5-0.7 C/W w/Joint Compound. Derate 1.0 C/watt for unplated part in natural convection only. Ordering Information Unplated IERC PART NO. Comm'l. Black Anodize HP1-TO66-CB HP1-TO66-35CB HP1-TO66-49CB Mil. Black Anodize HP1-TO66-B HP1-TO66-35B HP1-TO66-49B Semiconductor Accommodated Hole patt. Ref. No. (see pg. 1-28) 24 25 26 Max. Weight (Grams) HP1-TO66-U HP1-TO66-35U HP1-TO66-49U TO-66 TO-66 IC TO-66 IC (Socket) 35.0 35.0 35.0 HP1 Series for Dual TO-66 Outline DESCRIPTION OF CURVES C. N.C. Horiz. Device Only Mounted to G-10. G. N.C. Horiz. & Vert. With Dissipator. H. 200 RPM w/Diss. I. 500 RPM w/Diss. E. 1000 RPM w/Diss. * * * Thermal Resistance Case to Sink is 0.5-0.7 C/W w/Joint Compound. Derate 2.0 C/watt per device for unplated part in natural convection only. Case Temperatures Match Within 2C at equivalent power levels. Ordering Information Unplated IERC PART NO. Comm'l. Black Anodize HP1-TO66-4CB HP1-TO66-36CB Mil. Black Anodize HP1-TO66-4B HP1-TO66-36B Semiconductor Accommodated Hole patt. Ref. No. (see pg. 1-30) 32 34 Max. Weight (Grams) HP1-TO66-4U HP1-TO66-36U Two TO-66s Two TO-66 Ics 35.0 35.0 HP1 Series for Three TO-66 Outline DESCRIPTION OF CURVES D. N.C. Horiz. Device Only Mounted to G-10. J. N.C. Horiz. & Vert. With Dissipator. K. 200 RPM w/Diss. L. 500 RPM w/Diss. E. 1000 RPM w/Diss. * * * Thermal Resistance Case to Sink is 0.5-0.7 C/W w/Joint Compound. Derate 3.0 C/watt per device for unplated part in natural convection only. Case Temperatures Match Within 2C at equivalent power levels in natural convection. Ordering Information Unplated IERC PART NO. Comm'l. Black Anodize HP1-TO66-8CB HP1-TO66-39CB Mil. Black Anodize HP1-TO66-8B HP1-TO66-39B Semiconductor Accommodated Hole patt. Ref. No. (see pg. 1-30) 33 35 Max. Weight (Grams) HP1-TO66-8U HP1-TO66-39U Two TO-66s Two TO-66 Ics 35.0 35.0 HOLE PATTERNS 16. Hole pattern no. 1 accommodates T0-3s. Available in UP, 17. Hole pattern no. 202 accommodates T0-3 ICs. Available in UP1, UP2, HP1, and HP3 series heat dissipators. UP, UP1, UP2, HP1, and HP3 series heat dissipators. 18. Hole pattern no. 436 accommodates t0-3s (4-pin). Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 19. Hole pattern no. 2 accommodates T0-6s or T0-36s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 23. Hole pattern no. 3 accommodates TO-15s, DO-5s and other 1/4" stud mount devices. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 24. Hole pattern no. 114 accommodates TO-66s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 25. Hole pattern no. 199 accommodates TO-66 ICs. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 26. Hole pattern no. 226 accommodates TO-66 ICs (socket). Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. 31. Hole pattern no. 213 accommodates one TO-3 (panel mounted). Available in HP1 and HP3 series heat dissipators only. 32. Hole pattern no. 150 accommodates two TO-66s. Available in HP1 and HP3 series heat dissipators only. 33. Hole pattern no. 185 accommodates three TO-66s. Available in HP1 and HP3 series heat dissipators only. 34. Hole pattern no. 201 accommodates two TO-66s ICs. Available in HP1 and HP3 series heat dissipators only. 35. Hole pattern no. 203 accommodates three TO-66 ICs. Available in HP1 and HP3 series heat dissipators only. 27. Hole pattern no. 420 (Universal) accommodates T0-3s, T066s, T0-126s, T0-127s, or T0-220s. Available in UP, UP1, UP2, HP1, and HP3 series heat dissipators. CTS IERC, Heat Sinks and Thermal Management Solutions 413 North Moss Street, Burbank, California 91502 Tel: (818) 842-7277 Fax: (818) 848-8872 Rev. 03-15-04 |
Price & Availability of HP1-000-B
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